IC Packaging  [ Return towards  Electronic Components & Products  ]

There are several reasons why an IC is packaged, the primary goals are to: provide for electrical interconnection (both power and distribution), allow for efficient heat dissipation, and physically support and protect the IC.Since there are many different types of IC’s there are also many different types of packages. From Ball Grid Array (BGA) to Small Outline (SO), the complexity of the package will relate both to the application and complexity of the IC

The current advances in packaging technology, especially in Chip Scale Packages (CSP), are leading to packages with smaller pitches and more complex designs.
In the production of these advanced packages, as well as more traditional packages, the presence of moisture and oxides can lead to reductions in yields. Oxides can inhibit many of the different bonding steps, such as wire bonding or die attach, while moisture can get trapped in small areas of the package and create failures when any reflow or curing step is done.
Nitrogen has become a key to preventing some of these problems by creating an inert area around the process that is free of moisture and other impurities. In addition, the use of different gas mixtures such as H2/N2, as well as different plasma formulations have been shown to be effective in removing oxides and other organic impurities which will improve the process.

   
Please contact us for particular applications or questions regarding the use of gases in Semiconductor / IC packaging.